Thermal and thermal insulation materials for wafer fabrication processes.
Characteristics:
The product is a new composite quartz glass material with lower aluminum and alkali metal content. The middle layer is a high purity white opaque quartz material with excellent thermal insulating properties, and the two sides are semiconductor-grade transparent quartz material, which is more stable for use in high temperature areas, and the composite layer is fusion bonded without cavities.
Product Size(mm):
| Shape | Length/OD | Width | Thickness |
|---|---|---|---|
| Square Plate | 368 | 368 | 3.5~6 |
| Rectangular Plate | 550 | 368 | 3.5~6 |
| Disc | 365 | – | 3.5~6 |
Chemical Properties(ppm):
| Al | Ca | Cr | Cu | Fe | K | Li | Mg | Na | Ni |
|---|---|---|---|---|---|---|---|---|---|
| 8 | 0.60 | <0.05 | <0.05 | 0.20 | 0.20 | 0.20 | 0.20 | 0.50 | <0.05 |
Physical Properties:
| Items | Values |
|---|---|
| Density (g/cm3) | 2.05 |
| Bore Size (um) | ≈50 |
| Heat Conductivity (w/m.k 20°C) | 1.24 |
| Permittivity (500MHz 20°C) | 3.7 |
| Annealing Point (°C) | 1180 |
| Strain Point (°C) | 1070 |
